Indian Journal of Science and Technology

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Development of Electro-thermal Model for Quality Assurance of Materials


Affiliations
1 Sathyabama University, Chennai
 

This paper presents electro-thermal modeling using Resistance-Capacitance (RC) for transient heat conduction to inspect temperature variation over the surface of a material (AISI 316 steel) with defective and non-defective zones. An electrical based analytic approach for stepped infrared thermography is presented based on the correspondence between the fundamental laws of heat transfer and electricity. The construction of approximate analogous electrical models of thermal problem has been used in the mathematical analysis of heat transfer. A rigorous discussion of the heat dissipation mechanism over the material is performed, to show that the temperature over the defect region is always greater than the reference area and to prove the analogy of thermal to electrical parameter from the surface temperature evolution.

Keywords

Electro-thermal Modeling, Stepped Infrared Thermography, AISI 316 Steel, Analytic Approach, Analogy
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  • Development of Electro-thermal Model for Quality Assurance of Materials

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Authors

Merin Lizbeth George
Sathyabama University, Chennai
C. N. Ravi
Sathyabama University, Chennai
R. Harikrishnan
Sathyabama University, Chennai
G. R. P. Lakshmi
Sathyabama University, Chennai

Abstract


This paper presents electro-thermal modeling using Resistance-Capacitance (RC) for transient heat conduction to inspect temperature variation over the surface of a material (AISI 316 steel) with defective and non-defective zones. An electrical based analytic approach for stepped infrared thermography is presented based on the correspondence between the fundamental laws of heat transfer and electricity. The construction of approximate analogous electrical models of thermal problem has been used in the mathematical analysis of heat transfer. A rigorous discussion of the heat dissipation mechanism over the material is performed, to show that the temperature over the defect region is always greater than the reference area and to prove the analogy of thermal to electrical parameter from the surface temperature evolution.

Keywords


Electro-thermal Modeling, Stepped Infrared Thermography, AISI 316 Steel, Analytic Approach, Analogy

References





DOI: https://doi.org/10.17485/ijst%2F2013%2Fv6i5%2F33256