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Half Mode Substrate Integrated Waveguide 90° Coupler


Affiliations
1 Research Unit of Mechatronic Systems and Signals National Engineering School of Carthage, Tunis, Tunisia
2 Research Unit of HF Electronic Circuits and Systems, Faculty of Sciences of Tunis, Tunis El Manar 2092, Tunisia
 

Objectives: In the microwave band, couplers based on substrate integrated waveguides (SIW) take advantage of this technology’s performance such as low profile, low insertion losses, low interference. On the other hand suffers from the inconvenient of size. The motivation of this work is to develop a SIW 90° coupler using the new HMSIW technology to obtain a more compact SIW 90° coupler. Methodology: Recently, a new planar structure of waveguides has been proposed, called substrate waveguide (SIW). They are richly used and applied to stimulate high-quality devices for waves and millimeter waves thanks to its performances such as low-loss, high density of integration. A new half-mode substrate integrated waveguide 90° coupler (HMSIW) is proposed, with the aim of maintaining good coupler performance with a reduction of more than half of size. Findings: As compared with SIW coupler, the size of the HMSIW coupler is cuted down by approximately 62%. 90-degree phase shift delimited by the output port and the coupling port in the frequency bandwidth from about 10 GHz to 12.9 GHz is the coupler’s requirements. Since the proposed HMSIW couplers have characterized with a compact size, they could be integrated with other passive and active components. Application/Improvements: The HMSIW coupler achieves good performance that’s why they could be employed in communication applications and as essential elements for the manufacturing of other microwave devices.

Keywords

Communication Applications, 90° Coupler, Half Mode Substrate Integrated Waveguide, Microwave Devices, Substrate Integrated Waveguide
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  • Half Mode Substrate Integrated Waveguide 90° Coupler

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Authors

Abdelkhalek Nasri
Research Unit of Mechatronic Systems and Signals National Engineering School of Carthage, Tunis, Tunisia
Hani Wadie Badri
Research Unit of Mechatronic Systems and Signals National Engineering School of Carthage, Tunis, Tunisia
Hassen Zairi
Research Unit of Mechatronic Systems and Signals National Engineering School of Carthage, Tunis, Tunisia
Ali Gharsallah
Research Unit of HF Electronic Circuits and Systems, Faculty of Sciences of Tunis, Tunis El Manar 2092, Tunisia

Abstract


Objectives: In the microwave band, couplers based on substrate integrated waveguides (SIW) take advantage of this technology’s performance such as low profile, low insertion losses, low interference. On the other hand suffers from the inconvenient of size. The motivation of this work is to develop a SIW 90° coupler using the new HMSIW technology to obtain a more compact SIW 90° coupler. Methodology: Recently, a new planar structure of waveguides has been proposed, called substrate waveguide (SIW). They are richly used and applied to stimulate high-quality devices for waves and millimeter waves thanks to its performances such as low-loss, high density of integration. A new half-mode substrate integrated waveguide 90° coupler (HMSIW) is proposed, with the aim of maintaining good coupler performance with a reduction of more than half of size. Findings: As compared with SIW coupler, the size of the HMSIW coupler is cuted down by approximately 62%. 90-degree phase shift delimited by the output port and the coupling port in the frequency bandwidth from about 10 GHz to 12.9 GHz is the coupler’s requirements. Since the proposed HMSIW couplers have characterized with a compact size, they could be integrated with other passive and active components. Application/Improvements: The HMSIW coupler achieves good performance that’s why they could be employed in communication applications and as essential elements for the manufacturing of other microwave devices.

Keywords


Communication Applications, 90° Coupler, Half Mode Substrate Integrated Waveguide, Microwave Devices, Substrate Integrated Waveguide



DOI: https://doi.org/10.17485/ijst%2F2017%2Fv10i27%2F156279