Indian Journal of Science and Technology

Open Access Open Access  Restricted Access Subscription Access

Effect of Grain Size upon the Thermal Behavior of Copper and Diamond Powders using Differential Scanning Calorimetry (DSC)


Affiliations
1 Department of Mechanical Engineering, Annamalai University, Annamalai Nagar – 608 002, Tamil Nadu, India
2 Department of Manufacturing Engineering, Annamalai University, Annamalai Nagar – 608 002, Tamil Nadu, India
 

Objectives: In this study, the heat capacity and heat flow of varied grain size of copper and diamond powders were investigated. Methods: Heat capacity and heat flow of varied grain size of copper (1 μm-70 μm) and diamond powders (2 μm-300 μm) were measured using differential scanning calorimetry (DSC). The thermal properties of copper and diamond powders were determined in a temperature range of 0-500oC, with a heating rate of 5k/min in a nitrogen environment. Findings: Heat capacity and heat flow of copper and diamond powders increases with grain size and it is consistent with earlier researchers. Heat capacity of copper and diamond powders also increases with grain size. The heat capacity and heat flow was 1.4 J/gk and 0.24 mW/mg respectively for 60-70μm grain size of copper powder, whereas the values of the same were found to be 0.9 J/gk and 0.4 mW/mg for diamond powder of grain size in the range of 270 to 300 μm is determined. This study reveals that the diamond powders show better thermal performance over copper powder. Application/Improvements: Determination of thermal behavior is critical in determining the amount of heat transferred in micro electronics and solar thermal based applications.

Keywords

Copper, Diamond, Differential Scanning Calorimetry, Grain Size, Thermal Behavior.
User

Abstract Views: 132

PDF Views: 0




  • Effect of Grain Size upon the Thermal Behavior of Copper and Diamond Powders using Differential Scanning Calorimetry (DSC)

Abstract Views: 132  |  PDF Views: 0

Authors

G. Manikandan
Department of Mechanical Engineering, Annamalai University, Annamalai Nagar – 608 002, Tamil Nadu, India
G. Murugan
Department of Mechanical Engineering, Annamalai University, Annamalai Nagar – 608 002, Tamil Nadu, India
K. Raghukandan
Department of Manufacturing Engineering, Annamalai University, Annamalai Nagar – 608 002, Tamil Nadu, India

Abstract


Objectives: In this study, the heat capacity and heat flow of varied grain size of copper and diamond powders were investigated. Methods: Heat capacity and heat flow of varied grain size of copper (1 μm-70 μm) and diamond powders (2 μm-300 μm) were measured using differential scanning calorimetry (DSC). The thermal properties of copper and diamond powders were determined in a temperature range of 0-500oC, with a heating rate of 5k/min in a nitrogen environment. Findings: Heat capacity and heat flow of copper and diamond powders increases with grain size and it is consistent with earlier researchers. Heat capacity of copper and diamond powders also increases with grain size. The heat capacity and heat flow was 1.4 J/gk and 0.24 mW/mg respectively for 60-70μm grain size of copper powder, whereas the values of the same were found to be 0.9 J/gk and 0.4 mW/mg for diamond powder of grain size in the range of 270 to 300 μm is determined. This study reveals that the diamond powders show better thermal performance over copper powder. Application/Improvements: Determination of thermal behavior is critical in determining the amount of heat transferred in micro electronics and solar thermal based applications.

Keywords


Copper, Diamond, Differential Scanning Calorimetry, Grain Size, Thermal Behavior.



DOI: https://doi.org/10.17485/ijst%2F2016%2Fv9i48%2F140607