Abstract Views :181 |
PDF Views:0
Authors
Source
International Journal of Innovative Research and Development, Vol 3, No 11 (2014), Pagination:
Abstract
From a point of view of systems-level, semiconductor manufacturing crisscrosses with design outline, fabrication, integration, assembly and reliability. The elementary purpose of manufacturing are to tie all of these technologies together to achieve finished outcome with low cost, high quality and high reliability. Cost is most instantly influenced by yield and throughput. Quality is attained from a stable and well-composed manufacturing process while reliability results from curtailing the manufacturing faults.
Keywords
System structure, Bay Automation system, working span method
Full Text