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Dynamic Automation System for Semiconductor Manufacturing


 

From a point of view of systems-level, semiconductor manufacturing crisscrosses with design outline, fabrication, integration, assembly and reliability. The elementary purpose of manufacturing are to tie all of these technologies together to achieve finished outcome with low cost, high quality and high reliability. Cost is most instantly influenced by yield and throughput. Quality is attained from a stable and well-composed manufacturing process while reliability results from curtailing the manufacturing faults.

 

 


Keywords

System structure, Bay Automation system, working span method
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  • Dynamic Automation System for Semiconductor Manufacturing

Abstract Views: 181  |  PDF Views: 0

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Abstract


From a point of view of systems-level, semiconductor manufacturing crisscrosses with design outline, fabrication, integration, assembly and reliability. The elementary purpose of manufacturing are to tie all of these technologies together to achieve finished outcome with low cost, high quality and high reliability. Cost is most instantly influenced by yield and throughput. Quality is attained from a stable and well-composed manufacturing process while reliability results from curtailing the manufacturing faults.

 

 


Keywords


System structure, Bay Automation system, working span method