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Authors
Affiliations
1 Department of Electronics and Communication Engineering, Velammal College of Engineering and Technology, Madurai, Tamilnadu, IN
2 Department of Information Technology, Velammal College of Engineering and Technology, Madurai, Tamilnadu, IN
Source
Networking and Communication Engineering, Vol 2, No 8 (2010), Pagination: 221-224
Abstract
Now-a-days the demand on the operating speed of the devices with larger number of input/output pins is increasing by leaps and bounds. As the devices become faster, their output switching time decreases and causes the “Ground Bounce”. This effect threatens the operation of high-speed digital systems by causing false triggering and affects the signal integrity. This paper investigates the mechanisms causing ground bounce in PCB by deriving equivalent circuit. The techniques of reducing ground bounce are described.Time domain analysis of ground bounce has been performed for multiple traces using SPICE simulation tool.
Keywords
Signal Integrity, Crosstalk, Simultaneous Switching Noise, Micro Strip, Ground Bounce, SPICE Simulation.
