G. Venkata Subbaiah ¹, K. Vijay Kumar Reddy ²

Affiliations
1 Department of Mechanical Engineering SV Govt. Polytechnic, Tirupati–517507, IN
2 Department of Mechanical Engineering, JNTU College of Engineering, Kukatpally, Hyderabad-535 003, IN

Abstract

As microelectronics technology steadily packing more chip power into small packages, where balance is an important element of success in this electronic enclosure packaging. The design challenges include thermal management, vibration reduction and balancing reliability and maintainability. The present work, the objective is to design Ethernet switch cabinet/enclosure and the faceplate on which the Ethernet switch enclosure is mounted. Design considerations are made according to equipment requirement and IEEE and IEC standards. Sheet metal module in PRO-E is used to create 3D CAD models. The improvements are made on the basis of the results, using finite element analysis (FEA).

Keywords

Microelectronics Technology, Electronic Enclosure Packaging, Ethernet Switch

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G. Venkata Subbaiah ¹, Y. Suresh Reddy ², K. Vijay Kumar Reddy ³

Affiliations
1 Department of Mechanical Engineering, SV Govt. Polytechnic, Tirupati–517507, IN
2 CFD Analyst, Wipro Technologies, Bangalore, IN
3 Department of Mechanical Engineering, JNTU College of Engineering, Kukatpally, Hyderabad–500072, IN

Abstract

In this study, thermal analysis for the design of a complex electronic enclosure, Ethernet switch box is designed. The Ethernet Switch in iDEN EBTS (integrated Digital Enhanced Network Enhanced Base Transceiver System) is required for deployment of quad two way BR (Base Radio). Most of the devices in the base case are above the allowable temperature limit without any air vents and heat enhancing devices. Hence suggested to provide heat sink that enhances heat transfer on the critical components and operating well below the allowable temperature. In this paper, the investigations are carried for the improvement of device performance with the help of heat sink and side vents on the enclosure that increases the heat transfer. The complete analysis is carried out with commercial CFD (Computational Fluid Dynamics) software, Fluent V 6.1.22.

Keywords

BR - Base Radio, CFD - Computational Fluid Dynamics, PCB - Printed Circuit Board, IC - Integrated Circuit, FR4 -Fire Retardant 4 Grade, BCM - Bus Converter Module

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G. Venkata Subbaiah ¹, Y. Suresh Reddy ², K. Vijay Kumar Reddy ³

Affiliations
1 Department of Mechanical Engineering, S.V. Govt. Polytechnic, Tirupati–517507, IN
2 CFD analyst, Wipro Technologies, Bangalore, India, IN
3 Department of Mechanical Engineering, JNTU College of Engineering, Kukatpally, Hyderabad–500072, IN

Abstract

Attendant Control Panel (ACP) is a wall mounted unit which mainly integrates several Boeing 737NG system functions into a single control panel to provide the flight attendants with the ability to monitor and control cabin features. Thermal design has been developed to remove heat from the ACP through conduction and natural convection. Standoffs in the enclosure provided the effective conduction path to transfer heat from PWA (Printed Wire Assembly) to chassis. All critical device temperatures in the ACP are able to maintain well below the allowable temperature limit of 105oC without forced cooling. CFD(Computational Fluid Dynamics) simulations have been carried to analyze and improve thermal phenomena inside the ACP for three operating conditions namely normal operating (30oC), high operating (50oC) and short range operating (50oC to 60oC for 30 min) , using ANSYS Icepack, commercial CFD software. The thermal design of ACP is developed in this paper to maintain its operating temperature within the limits, without any electrical degradation.

Keywords

ACP - Attendant Control PanelL, PWA - Printed Wire Assembly, CFD - Computational Fluid Dynamics, LCD - Liquid Crystal Display, LRU - Line Replaceable Unit, PCB - Printed Circuit Board

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