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Pradeep, K.
- 3D Model of Injured Skull and Finite Element Analysis
Authors
1 Department of Bio Medical Engineering, PSNA College of Engineering and Technology, Dindigul, IN
Source
Biometrics and Bioinformatics, Vol 9, No 6 (2017), Pagination: 109-112Abstract
A head injury is any trauma that causes damage to the scalp, skull, or brain. The injuries can range from a minor bump on the skull to serious brain injury. The prosthesis of the skull may be developed to assist the function of the defected area. The prosthesis may be made from different materials based on biocompatibility. The type of biomaterial to be used is decided by the doctor. This 3D model of injured skull plays a major role for the doctors to make a clear decision. In this project, a CT image of an injured skull (DICOM format) was fed into MIMICS (Materialise’s Interactive Medical Imaging System) software in which 3D model was constructed from a cross sectional 2D image. The obtained 3D model was then exported into 3-MATIC software in which files required for Finite Element Analysis was prepared. The output image from 3-matic was tested for various biomechanical properties by Finite Element Analysis using ANSYS software. The parameters need to be measured on 3-D image are displacement, von mises stress, von mises strain for the applied load. The Rapid Prototyping model was created.
Keywords
Prosthesis, Biocompatibility, MIMICS, 3-MATIC, Finite Element Analysis. ANSYS, Rapid Prototyping.References
- Pradeep, K., et al. "A Novel Approach for Prediction of Bulging in the type A Dissected Aorta Using MIMICS Tool." Asian Journal of Science and Applied Technology 4.1 (2015): 26-31.
- Ruan, J. S., T. Khalil, and Albert I. King. "Dynamic response of the human head to impact by three-dimensional finite element analysis." transactions-american society of mechanical engineers journal of biomechanical engineering 116 (1994): 44-44.
- Voo, L., et al. "Finite-element models of the human head." Medical and Biological Engineering and Computing 34.5 (1996): 375-381.
- Kleiven, Svein, and Warren N. Hardy. "Correlation of an FE model of the human head with local brain motion: Consequences for injury prediction." Stapp Car Crash Journal 46 (2002): 123-144.
- Shweta, P., and M. Anburajan. "Finite element analysis of the skull implant using Ansys software." Electronics Computer Technology (ICECT), 2011 3rd International Conference on. Vol. 3. IEEE, 2011.
- Lin, Liulan, et al. "Application of Image Processing and Finite Element Analysis in Bionic Scaffolds’ Design Optimizing and Fabrication." International Conference on Life System Modeling and Simulation. Springer Berlin Heidelberg, 2007.
- Wagner, Christina Devito. "Computational simulation of skull fracture patterns in pediatric subjects using a porcine model." (2011).
- Effect of ambient temperature on the performance of power electronic converters
Authors
1 Energy Efficiency and Renewable Enenrgy Division, Central Power Research Institute, Bangalore- 560080, IN
2 E&E Department, Manipal Institute of Technology, Manipal - 576104, IN
3 Diagnostics Cables and capacitors Division, Central Power Research Institute, Bangalore - 560080, IN
4 Energy Efficiency and Renewable Energy Division, Central Power Research Institute, Bangalore - 560080, IN
Source
Power Research, Vol 10, No 4 (2014), Pagination: 769-774Abstract
Efficiency of power electronics devices are highly dependent on temperature. Hence temperature compensation and heat sink design are very important factors in maintaining the performance quality of power electronic converters. Thus the ambient temperature at which the device is operating also effects the performance since the heat removal by heat sinks or cooling fans is affected by the ambient temperature. Here a detailed analysis of the dependency of losses in power electronic switches on the junction temperature and in turn ambient temperature is presented. A theoretical Analysis of conduction losses and effect of ambient temperature on it is presented along with a set of experimental results by analyzing the performance of a 850W Solar PV inverter at various ambient temperatures. The results are satisfactorily explaining the effect of ambient temperature on converter efficiency.Keywords
Solar PV inverters, conduction Losses, heat sink, ambient temperature- Performance Loss in Solar Photovoltaic Array due to Non-ideal Natural Conditions
Authors
1 Electrical Appliances Technology Division, Central Power Research Institute, Bangalore-560080, IN
2 Energy Efficiency and Renewable Energy Division, Central Power Research Institute, Bangalore-560080, IN
Source
Power Research, Vol 10, No 1 (2014), Pagination: 131-136Abstract
Performance of a SPV system is dependent on temperature, array configuration, solar insolation, and shading across it. Shading can occur when the PV arrays/modules get covered by shadows of passing clouds, buildings, etc., or even by shadows cast by other modules/arrays. As a result the ideal operation of the PV systems is severely affected the P-V and I-V characteristics. The modeling of nonlinear current-voltage characteristics of solar cells for performance prediction becomes difficult under the influence of shading. Non-uniform solar radiation due to shadows casted by the other panels/ modules, buildings, clouds, etc. can cause maximum power to change drastically. Partial shading of PV installations has an impact on its power production. For the simulated results it has been observed that 74.66% loss in I-V characteristics and 85.41% loss in P-V characteristics respectively. The power losses in the individual shaded cells would result in local heating and create thermal stress on the entire module/array resulting in hot-spot formation.Keywords
Maximum power point tracking (MPPT), Partial shading, Solar photovoltaic (SPV) characteristics.- Application of Synchronised Phasor Measurement Technology in Renewable Energy Systems
Authors
1 Energy Efficiency and Renewable Energy Division, Cental Power Research Institute, Bangalore-560 080, IN
2 Diagnostics Cables and Capacitors Division, Central Power Research Institute, Bangalore 560 080, IN
3 Dept. of Electrical and Electronics Engg., Manipal institute of technology, Manipal,Karnataka- 576 104, IN