Refine your search
Collections
A B C D E F G H I J K L M N O P Q R S T U V W X Y Z All
Mahendran, G.
- Optimization of Diffusion Bonding Process Parameters of Aluminium AA6061-Fly Ash Composites Using Taguchi Method
Abstract Views :282 |
PDF Views:103
Authors
Affiliations
1 Dept. of Mech. Engg., Sathyabama University, Chennai, Tamil Nadu, IN
2 IFET College of Engg., Villupuram, Tamil Nadu, IN
1 Dept. of Mech. Engg., Sathyabama University, Chennai, Tamil Nadu, IN
2 IFET College of Engg., Villupuram, Tamil Nadu, IN
Source
International Journal of Vehicle Structures and Systems, Vol 9, No 4 (2017), Pagination: 225-227Abstract
This paper focused to determine optimal bonding parameters based on Taguchi method for maximizing bonding strength. The experiments were conducted on diffusion bonding machine using aluminium fly ash (AFA) composites. Three bonding parameters such as temperature, pressure and time, each at three levels were examined. Taguchi L27 orthogonal array was used as a design of experiment. The response table and the analysis of variance (ANOVA) were calculated to determine which process parameters significantly affect the bonding strength and also the % contribution of each parameter. The results show that the combination of factors and their levels of A2B3C3 i.e. the bonding done at a temperature of 475°C with a pressure of 10 MPa and time for 20 minutes yielded the optimum i.e. maximum bonding strength. Finally, ANOVA results indicated that all three process parameters significantly affected the bonding strength with a maximum contribution from the bonding temperature (85.93%), followed by bonding time (12.6%) and bonding pressure (1.48%). It is also observed that the bonding strength of the diffusion bonding process can be improved effectively through this approach.Keywords
Diffusion Bonding, Aluminium Fly Ash, Analysis of Variance, Bonding Strength.Full Text
References
- S. Gopalakannan, T. Senthilvelan and S. Ranganathan 2013. Statistical optimization of EDM parameters on machining of aluminium hybrid metal matrix composite by applying Taguchi based grey analysis, J. Scientific Industrial Research, 72, 358-365. http://nopr.niscair.res.in/handle/123456789/18676.
- S. Das. 2004. Development of aluminium alloy composites for engineering applications, Trans. Indian Inst. Metals., 57(4), 25-334.
- D.R. Selvam, D.S.R. Smart and I. Dinaharan. 2013. Microstructure and some mechanical properties of fly ash particulate reinforced AA6061 aluminium alloy composites prepared by compo casting, Materials & Design, 49, 28-34. http://dx.doi.org/10.1016/j.matdes.2013.01.053.
- X.P. Zhang, L. Ye, Y.W. Mai, G.F. Quan and W. Wei. 1999. Investigation on diffusion bonding characteristics of sic particle reinforced aluminium metal matrix composites (Al/Sic-MMC), Composites, 30, 1415-1421. http://dx.doi.org/10.1016/S1359-835X(99)00040-8.
- G. Mahendran, V. Balasubramanian and T. Sethilvelan. 2011. Mechanical and metallurgical properties of diffusion bonded AA2024 aluminium alloy and commercial grade copper, Elixir Mech. Engg., 38, 4283-4289.
- G. Mahendran, S. Babu and V. Balasubramanian. 2010. Analyzing the effect of diffusion bonding process on bond characteristics of Mg-Al dissimilar joints, J. Material Engg. and Performance. 19(5), 657-665. http://dx.doi.org/10.1007/s11665-009-9531-6.
- G. Mahendran, V. Balasubramanian and T. Senthilvelan. 2010. Influence of diffusion bonding process parameter on bond characteristics of Mg-Cu dissimilar joints, Trans. Non Ferrous Met. Soc., 20, 997-1005. http://dx.doi.org/10.1016/S1003-6326(09)60248-X.
- G. Mahendran, V. Balasubramanian and S. Babu. 2010. Optimizing diffusion bonding process parameters to attain maximum strength in Al-Cu dissimilar joints using response surface methodology, Int. Manuf. Research, 5(2), 181-198. http://dx.doi.org/10.1504/IJMR.2010.031631.
- A. Sittaramane and G. Mahendran. 2015. Diffusion bonding - process and its variables: A review, Int. J. Application Engg. Research, 10(83), 27-29 110.
- M. Puviyarasan and V.S. Senthilkumar. 2012. Optimization of friction stir process parameters in fabricating AA6061/SiCp composites, Procedia Engg., 38, 1094-1103.
- Developing Empirical Relationships to Predict Diffusion Layer Thickness, Hardness and Strength of Al-Cu Dissimilar Joints
Abstract Views :218 |
PDF Views:5
Authors
Affiliations
1 Centre for Material Joining & Research, Manufacturing Dept., Annamalai University, IN
2 Mech. Engg, Pondicherry Engineering College, Pondicherry, IN
1 Centre for Material Joining & Research, Manufacturing Dept., Annamalai University, IN
2 Mech. Engg, Pondicherry Engineering College, Pondicherry, IN
Source
Indian Welding Journal, Vol 41, No 3 (2008), Pagination: 37-45Abstract
The principal difficulty when joining Aluminium (Al) and commercial grade Copper (Cu) lies in the existence of formation of oxide films and brittle intermetallics in the bond region. However, diffusion bonding can be used to join these alloys without much difficulty. Temperature, pressure and holding time are the three main variables, which govern the integrity of the diffusion bonds. The experiments were conducted based on three factors, five-levels, and central composite rotatable design with full replications technique. Empirical relationships were developed to predict diffusion layer thickness, hardness, strength of Al-Cu joints incorporating process parameters using Response Surface Methodology. The developed relationships can be effectively used to predict the bond properties at 95 % confidence level.
