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Pavithra, B.
- Reduce Crime Attacks on Online Transactions Using Biometric Identifier and OTP
Authors
1 Department of Computer Science and Engineering, Dr. M.G.R Educational & Research Institute University, IN
2 Department of Computer Science and Engineering, Dr. M.G.R Educational & Research Institute University, IN
Source
Biometrics and Bioinformatics, Vol 7, No 6 (2015), Pagination: 163-165Abstract
The development in electronic communication has resulted in a bigger demand for speedy and precise user recognition and verification. Access codes for building, bank financial records and computer systems frequently employ personal identification numbers (PIN's) for recognition and security verifications. Traditional method of identification based on possession of ID cards or elite information like a social security number or a password are not all together dependable. To enlarge the security in the authentication process Biometric authentication and other digital signatures are used even though they give the successful authentication they are feeble against online attacks like botnet, malware, Intruders, spoofing ECT. In this scheme fingerprint biometric technique and Onetime password is used for well-organized authentication and anti-spoofing, Intruder detection system, DIKE key exchange and encryption technique to give efficient security against online attacks.
Keywords
Biometrics, DIKE, OTP, Malware Detection, Botnet Detection.- Development and Performance Evaluation of Self Adhesive Sputtered Thin Film Strain Gauges
Authors
1 REVA University, Bengaluru, IN
2 Indian Institute of Science, Bengaluru, IN
Source
Manufacturing Technology Today, Vol 19, No 10 (2020), Pagination: 27-32Abstract
In many industrial and academic applications force, pressure and displacement are measured using strain gauges bonded with adhesives on the object to be tested. This paper presents development and performance investigation of non-intrusive self adhesive Thin Film Strain Gauges (TFSGs) for applications demanding quick gauge installation on test objects; eliminating a conventional step of applying adhesives for installation and curing. Self adhesive TFSGs of NiCr (metal alloy) and ITO (degenerate semiconductor) are fabricated. Distinction in the piezoresistive responses and gauge factor of metal alloy and degenerate semiconductor thin film strain gauges are measured and studied by cantilever beam bending method.Keywords
Thin Film, Thin Film Strain Gauge, Self-Adhesive, Sputtering, Piezoresistivity, ITO, NiCr.- Effective and Active Temperature Compensation of High-Pressure Mems Pressure Transducers for Aerospace Applications
Authors
1 Indian Institute of Science, Bangalore, IN
2 NMIT, Bangalore, IN