Indian Journal of Engineering & Materials Sciences

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Investigation of active surface area of tool electrode and peak current on discharge energy during ECDM process


Affiliations
1 Mechanical Engineering Department, Engineering College Bikaner, Rajasthan 334 004, India
2 Mechanical and Industrial Engineering Depaartment, Indian Institute of Technology, Roorkee, Uttrakhand 247 667, India

The Electrochemical Discharge Machining (ECDM) process is a hybrid non-conventional machining process. It is used for machinings hard and brittle materials such as borosilicate glass and ceramic materials. In the ECDM process, active surface area ( dipped tool ) and peak current affect the discharge energy, which further influences the quality of the micro holes. The present article is aimed to investigate the effect of active surface area and peak current on the performance characteristics during the ECDM process. Experiments were conducted to investigate the affect of active surface area and peak currenton Depth Of Penetration (DOP), the Hole Over Cut (HOC), and Material Removal Rate (MRR) based on the reaction rate during ECDM of borosilicate glass. The experimental results reveal that both the MRR and HOC increase in increasing the peak current and decreasing the active surface area. The maximum DOP and MRR were obtained at 5A peak current with 2 mm tool immersion depth and 7A peak current with 1 mm tool immersion depth, respectively. The minimum HOC was obtained at 2A peak current with a 3 mm tool immersion depth.
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  • Investigation of active surface area of tool electrode and peak current on discharge energy during ECDM process

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Authors

Ranjeet Singh Rathore
Mechanical Engineering Department, Engineering College Bikaner, Rajasthan 334 004, India
Akshay Dvivedi
Mechanical and Industrial Engineering Depaartment, Indian Institute of Technology, Roorkee, Uttrakhand 247 667, India

Abstract


The Electrochemical Discharge Machining (ECDM) process is a hybrid non-conventional machining process. It is used for machinings hard and brittle materials such as borosilicate glass and ceramic materials. In the ECDM process, active surface area ( dipped tool ) and peak current affect the discharge energy, which further influences the quality of the micro holes. The present article is aimed to investigate the effect of active surface area and peak current on the performance characteristics during the ECDM process. Experiments were conducted to investigate the affect of active surface area and peak currenton Depth Of Penetration (DOP), the Hole Over Cut (HOC), and Material Removal Rate (MRR) based on the reaction rate during ECDM of borosilicate glass. The experimental results reveal that both the MRR and HOC increase in increasing the peak current and decreasing the active surface area. The maximum DOP and MRR were obtained at 5A peak current with 2 mm tool immersion depth and 7A peak current with 1 mm tool immersion depth, respectively. The minimum HOC was obtained at 2A peak current with a 3 mm tool immersion depth.