Manufacturing Technology Today

Sarat Kumar Dash ¹, A. M. Khan ², Jaipal Doraisamy ³, Ramachandra Chitakudige ⁴

Affiliations
1 ISRO Satellite Centre, Air Port Road, Vimanapuram, Bangalore, IN
2 Department of Electronics, Mangalore University, Konaje, IN
3 Tessolve Services Pvt Ltd, 31, Phase II, Electronics City, Bangalore, IN
4 C.M.T.I, Tumkur Road, Bangalore, IN

Abstract

Platinum and tungsten have been widely used for making electrical contact using FIB for circuit edit. However they find limitation in small structure via filling. Molybdenum is becoming one of the promising materials to be used in FIB for electrical contact. Electrical characterization of FIB deposited molybdenum contact is described in this paper. Electrical resistivity, via filling capability, electro migration resistance and environmental resistance of FIB deposited molybdenum has been studied. FIB deposited molybdenum has shown better via filling capability and improved electro migration resistance. However molybdenum contacts are found to be susceptible to humidity induced degradation. Recapping the device after circuit edit with appropriate epoxy potting compound is found to provide excellent protection against humidity induced degradation.

Keywords

VLSI, CIRCUIT EDIT, FIB, HAR, GDS.

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A. Mallikarjuna Reddy ¹, Md. Nazrul Islam ¹, Sarat Kumar Dash ¹, B. S. Srinivasa ¹, Y. R. Bhanumathy ¹

Affiliations
1 Spacecrafts Reliability and Quality Area, U R Rao Satellite Centre, Bengaluru, IN

Abstract

X-ray inspection systems are key tools for quality control, yield enhancement and failure analysis of PCBs and semiconductor devices for over two decades. In many cases, these capable tools provide the only non-destructive techniques for inspection of electronic components. There have been significant improvements in the X-ray inspection capabilities (both 2D and 3D) in the last several years. Applications such as artificial intelligence (AI), 5G, high-performance computing and internet-of-things (IOT) mandate higher IO density and 3D scaling at the device, package and system levels, thereby increasing the need for non-destructive imaging at high resolution and preferably in 3D. In this paper, we discussed a nondestructive approach for printed circuit board (PCB) by using real time x-ray imaging system under 3D mode. We demonstrate our proposed process on PCB, a six-layer custom designed board and few more complex commercial boards.

Keywords

Non-Destructive Technique (NDT), Real Time X-ray Imaging, Printed Circuit Boards (PCB).

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