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Khanna, P. K.
- Micro Thick Films Growth Problems on Low Temperature Cofired Ceramic Substrate in Pre-Firing Method
Abstract Views :310 |
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Authors
Affiliations
1 Central Electronics Engineering Research Institute (CEERI), Council of Scientific and Industrial Research (CSIR), Pilani, Rajasthan, IN
1 Central Electronics Engineering Research Institute (CEERI), Council of Scientific and Industrial Research (CSIR), Pilani, Rajasthan, IN
Source
Manufacturing Technology Today, Vol 14, No 9 (2015), Pagination: 18-21Abstract
The present paper reports on the micro thick film growth problems on Low temperature co-fired ceramic technology. The focused interconnection technique is isothermal solidification to provide, power supply connection for micro heater. In this isothermal solidification process, the diffused amount of material and formation of intermetallic phase molecules depends on the surface growth , grain size of the micro thick films, resultant contact surface area with inter layer, temperature and density gradient between the base layer to solder layer. Surface growths of the silver thick film on LTCC substrate is studied with the help of SEM.Keywords
Isothermal Solidification, Surface Growth, Hybrid Micro Thick Films, Diffusion.- Optimization of LTCC Structure for Stable Interconnections
Abstract Views :295 |
PDF Views:0
Authors
Affiliations
1 CSIR – Central Electronics Engineering Research Institute, Pilani, Rajasthan, IN
1 CSIR – Central Electronics Engineering Research Institute, Pilani, Rajasthan, IN
Source
Manufacturing Technology Today, Vol 13, No 10 (2014), Pagination: 18-19Abstract
Reliability of electrical connections of a Low Temperature Co-fired Ceramics (LTCC) device is always a challenge. LTCC base plates are fabricated, over which a device or a sensor can be placed. Vias punched at the corners allows the provision for the electrical connection to the sensor. Conductive PdAg lines printed over the surface can be used to join the sensor part with the base plate using brazing technique. Cost of fabrication is lowered by punching the cavities using a zig fixture.Keywords
Low Temperature Co-Fired Ceramics (LTCC), Base Plate, TCE, Sensor.- Fabrication of Inductor in LTCC Technology
Abstract Views :288 |
PDF Views:0
Authors
Affiliations
1 CSIR-Central Electronics Engineering Research Institute, Pilani, Rajasthan, IN
1 CSIR-Central Electronics Engineering Research Institute, Pilani, Rajasthan, IN