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Agrawal, Megha
- Micro Capacitive Pressure Sensor Using Polymumps Process
Abstract Views :201 |
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Authors
Affiliations
1 Central Manufacturing Technology Institute, Bangalore, IN
1 Central Manufacturing Technology Institute, Bangalore, IN
Source
Manufacturing Technology Today, Vol 13, No 7 (2014), Pagination: 26-30Abstract
The work presented in this paper involves design, analysis and simulation of micro fixed-fixed beam as a capacitive pressure sensor which is designed by using PolyMUMPs: Polysilicon Multi User MEMS Process. By applying a pressure on the top of fixed-fixed beam, the mechanical force pulls the beam down and increases the capacitance. The change in length of the beam influences the range of applied pressure while the effect of beam width on this is negligible. The PolyMUMPs was developed by MEMSCAP foundry focusing on the fabrication, reliability and cost effectiveness. This presented MEMS pressure sensor is capable of measuring pressure between 0.1MPa to 1.7 MPa which is useful in various field of applications.Keywords
Polymumps, MEMS, Beam, Pressure Sensor.
- Wet Chemical Etching for Glass Micro-Machining
Abstract Views :256 |
PDF Views:0
Authors
Affiliations
1 Central Manufacturing Technology Institute, Bangalore, IN
1 Central Manufacturing Technology Institute, Bangalore, IN
Source
Manufacturing Technology Today, Vol 18, No 1 (2019), Pagination: 11-13Abstract
In this paper, wet etching of Pyrex Glass using different chemicals is presented. The advantages as well as disadvantages of each method are presented and discussed in light of the experiments. The etch rates of Glass in different dilutions of HF (Hydrofluoric Acid) and BHF (Buffered Hydrofluoric Acid) are reported. Different agitation techniques are applied during process and results are compared. The improvement in the etching uniformity is achieved by string the solution continuously during etching time. Etch rate of Glass in HF solution is much higher than BHF solution and can be controlled based on concentration. Samples are characterized using Universal Length Measurement (ULM) system and optical profiler.Keywords
Wet Etching, MEMS, Glass, Etch Rate.References
- Nguyen Van Toan, Masaya Toda and Takahito Ono; An Investigation of Processes for Glass Micromachining; Micromachines 2016, 7, 51
- Kirt R. Williams, , Kishan Gupta and Matthew Wasilik; Etch Rates for Micromachining Processing—Part II; Journal Of Microelectromechanical Systems, vol. 12, no. 6, December 2003.
- Ciprian ILIESCU, Wet Etching of Glass for MEMS Applications, Romanian Journal Of Information Science And Technology, vol. 9, no. 4, 2006, 285-309
- Low Temperature Cu-Cu Thermo-compression Bonding for Advanced Micro-System Packaging
Abstract Views :218 |
PDF Views:0
Authors
Affiliations
1 Karunya Institute of Technology and Sciences, Coimbatore, IN
2 Central Manufacturing Technology Institute, Bangalore, IN
1 Karunya Institute of Technology and Sciences, Coimbatore, IN
2 Central Manufacturing Technology Institute, Bangalore, IN
Source
Manufacturing Technology Today, Vol 19, No 9 (2020), Pagination: 46-50Abstract
Low-temperature wafer-level Copper (Cu)-Copper (Cu) thermo-compression bonding has been an attractive choice in terms of its compatibility for microelectronics metallization and its lower cost. To achieve Low temperature Cu-Cu thermo compression bonding, copper oxide should be removed on the surface of the metal. In this paper, the effectiveness of the acetic acid pretreatment for removal of copper oxide before bonding is analysed. The thermo compression bonding is carried out at 2500C for 1 hr followed by 30 min annealing. Further to find the quality of bonding, different characterization techniques are carried out such as dicing of wafers, bond strength test, and SEM analysis.Keywords
MEMS, Thermo Compression Bonding, Pre Chemical Treatment, 3D IC Integration.- Development of Signal Conditioning System for Biosensor Applications
Abstract Views :195 |
PDF Views:0
Authors
Affiliations
1 Central Manufacturing Technology Institute, Bangalore, IN
1 Central Manufacturing Technology Institute, Bangalore, IN
Source
Manufacturing Technology Today, Vol 19, No 9 (2020), Pagination: 56-59Abstract
This signal conditioning circuit design is a micro-power, three terminal electrochemical cell amplifier that uses less than 1-μA total supply current for battery-powered or energy-harvested sensor applications. Electrochemical cells necessitate constant bias, which requires the amplifier circuit to be powered continuously to eliminate sensor start-up and settling times. The design is assembled on a dotted board compatible with the development Kit platform to allow testing with an MSP430 ultra-low-power processor to utilize the launchpad processor analog to digital converters (ADCs) and liquid crystal display (LCD) for stand-alone operation. The whole design consideration is done after taking into consideration of three-terminal screen printed electrode that can have several applications as verified by experimentations and results. The design can be used for agricultural applications as a wide range of sensor current has been taken into design consideration. This needs simple modification based on sensitivity and response time of sensor.Keywords
MSP430, Op-Amp, Screen Printed Electrode, Trans-Impedance Amplifier, Potentiostat, Current Source.- Design and analysis of micro thermal mass flow sensor using thin-filmbased thermocouples
Abstract Views :113 |
PDF Views:0
Authors
Affiliations
1 Central Manufacturing Technology Institute, Bengaluru, India
2 Central Manufacturing Technology Institute, Bengaluru, India, IN
1 Central Manufacturing Technology Institute, Bengaluru, India
2 Central Manufacturing Technology Institute, Bengaluru, India, IN
Source
Manufacturing Technology Today, Vol 22, No 3 (2023), Pagination: 8 - 13Abstract
MEMS (Micro-electro mechanical system) based thermal flow sensors are getting more importance due to their ease of fabrication, small size, and high measurement resolution. In this proposed work, a Micro-Thermal flow sensor (TFS) based on MEMS technology is designed using thin film-based thermocouples. This work mainly focuses on materials selection, and identification of fabrication process followed by design, simulation and analysis of Micro-TFS. In this work, Thermopile temperature sensor is selected for Micro-TFS to overcome the drawbacks of other Temperature sensors. Aluminium and Phosphorus materials combination is selected for the Thermopile sensor, which generates a better See-beck coefficient and produces more output voltage. Fabrication process flow based on MEMS technology is identified for Micro-TFS. This proposed flow sensor is capable to measure up to 7 LPM, for a 6 mm diameter channel in Direct-flow mode and up to 110 LPM, for a 25 mm diameter channel in By-pass flow mode.Keywords
Thermal Flow Sensor, Thermopile, See-Beck Effect, Calorimetric, MEMS.References
- Ashauer, M., Glosch, H., Hedrich, F., Hey, N., Sandmaier, H., & Lang, W. (1998). Thermal Flow Sensor for Liquids and Gases. Micro-ElectroMechanical Systems (MEMS). https://doi.org/10.1115/imece1998-1280
- Balakrishnan, V., Phan, H.-P., Dinh, T., Dao, D., & Nguyen, N.-T. (2017). Thermal Flow Sensors for Harsh Environments. Sensors, 17(9), 2061.https://doi.org/10.3390/s17092061
- Billat, S., Kliche, K., Gronmaier, R., Nommensen, P., Auber, J., Hedrich, F., & Zengerle, R. (2007).
- Monolithic Integration of Micro-Channel on Disposable Flow Sensors for Medical Applications. TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference. https://doi. org/10.1109/sensor.2007.4300064
- Dou, Y. W., Qiu, C. J., Zang, B., Wang, J. X., & Zhang, X. D. (2015). Design and Simulation of Thermopile Sensor Technology Based on Porous Silicon. Applied Mechanics and Materials, 741, 289-293.
- https://doi.org/10.4028/www.scientific.net/ amm.741.289
- Flores, E., Ares, J. R., Castellanos-Gomez, A., Barawi, M., Ferrer, I. J., & Sánchez, C. (2015).
- Thermoelectric power of bulk black-phosphorus. Applied Physics Letters, 106(2), 022102. https:// doi.org/10.1063/1.4905636
- Hedrich, F., Kliche, K., Storz, M., Billat, S., Ashauer, M., & Zengerle, R. (2010). Thermal flow sensors for MEMS spirometric devices. Sensors and Actuators A: Physical, 162(2), 373-378. https:// doi.org/10.1016/j.sna.2010.03.019
- Innovative Sensor Technology IST AG ( n.a). SFS01 Silicon flow Sensors. https://www.ist-ag.com/ sites/default/files/downloads/sfs01.pdf
- Khan, M. S., Tariq, M. O., Nawaz, M., & Ahmed, J. (2021). MEMS Sensors for Diagnostics and Treatment in the Fight Against COVID-19 and Other Pandemics. IEEE Access, 9, 61123-61149. https://doi.org/10.1109/access.2021.3073958
- Kim, T. H., & Kim, S. J. (2006). Development of a micro-thermal flow sensor with thin-film thermocouples. Journal of Micromechanics and Microengineering, 16(11), 2502-2508. https:// doi.org/10.1088/0960-1317/16/11/035
- Kuo, J. T. W., Yu, L., & Meng, E. (2012). Micromachined Thermal Flow Sensors—A Review. Micromachines, 3(3), 550-573. MDPI AG. Retrieved from http://dx.doi.org/10.3390/ mi3030550
- Mahvi, A. J., El Fil, B., & Garimella, S. (2019). Accurate and inexpensive thermal time-offlight sensor for measuring refrigerant flow in minichannels. International Journal of Heat and Mass Transfer, 132, 184-193. https://doi. org/10.1016/j.ijheatmasstransfer.2018.11.133
- Moisello, E., Malcovati, P., & Bonizzoni, E. (2021). Thermal Sensors for Contactless Temperature
- Measurements, Occupancy Detection, and Automatic Operation of Appliances during the COVID-19 Pandemic: A Review. Micromachines, 12(2), 148. https://doi.org/10.3390/mi12020148
- Zhang, S., & Liao, X. (2020). The thermoelectricphotoelectric integrated power generator and
- its design verification. Solid-State Electronics, 170, 107818. https://doi.org/10.1016/j.sse.
- 107818