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Singh, Jaspreet
- Measurement of Static Pressure Over Bodies in Hypersonic Shock Tunnel Using MEMS-based Pressure Sensor Array
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Authors
Affiliations
1 Dept. of Aerospace Engg, Indian Institute of Science, Bangalore, IN
2 Indian Space Research Organisation, Dept. of Space, Bangalore, IN
1 Dept. of Aerospace Engg, Indian Institute of Science, Bangalore, IN
2 Indian Space Research Organisation, Dept. of Space, Bangalore, IN
Source
Manufacturing Technology Today, Vol 11, No 8 (2012), Pagination: 14-19Abstract
This paper reports on development of MEMS based pressure sensors arrays for static pressure measurement on aerodynamic surfaces. The two different types of sensors arrays with cluster of 25 sensors and 5 sensors are developed. The characterization of pressure sensors arrays carried out in static condition and the working of sensors has been demonstrated for hypersonic flows in shock tunnel with the cluster of 5 sensors array. The static pressure measured using the MEMS sensors in shock tunnel testing are in good agreement with conventional Kulite sensors.Keywords
Pressure Measurements, MEMS Sensors, Hypersonic Flow, Pressure Sensor.- Experimental Analysis of Conformality of E–Beam Deposited Thin Films for Mems Applications
Abstract Views :175 |
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Authors
Affiliations
1 MEMS Fabrication Division, Semi-Conductor Laboratory Mohali, IN
2 Indian Institute of Technology, Kanpur, IN
1 MEMS Fabrication Division, Semi-Conductor Laboratory Mohali, IN
2 Indian Institute of Technology, Kanpur, IN
Source
Manufacturing Technology Today, Vol 19, No 9 (2020), Pagination: 51-55Abstract
The uses of metal thin films are versatile and very well established in the field of CMOS and MEMS devices. Although, today’s many system manufacturing units provides facility to control the physical parameters such as thickness uniformity and deposition rate. However, the impact of tool parameters must be optimized to understand and quantify for better process control. In this work, we have studied a qualitative conformality of metal thin films deposited with E- beam evaporation method. This is very important parameter for realization of MEMS devices, particularly for Through Silicon Via (TSV), MEMS Probe Card and G Switches. In this work, we present detailed qualitative study of metal filling over the bulk micro machined trench patterns and estimate the conformality values with two different types of rotation setup provided in E-beam tool for batch process of MEMS on to the 6” Si wafers.Keywords
Metal Thin Films, Conformality, Bulk- Micromachined, E- Beam Evaporation Tool.- Low Temperature Anodic Bonding Process with Silicon-Gold-Glass Interface for Wafer Level Packaging Applications
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Authors
Affiliations
1 MEMS Fabrication Division, Department of Space, Semi-Conductor Laboratory, Mohali, IN
1 MEMS Fabrication Division, Department of Space, Semi-Conductor Laboratory, Mohali, IN