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Bandopadhyay, Anwesha
- Quality Analysis of Paperboard Products Printed by Rotogravure Process
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Authors
Affiliations
1 Department of Printing Engineering, Jadavpur University, Saltlake Campus, Kolkata-700098, IN
2 Department of Printing Engineering, Jadavpur University, IN
1 Department of Printing Engineering, Jadavpur University, Saltlake Campus, Kolkata-700098, IN
2 Department of Printing Engineering, Jadavpur University, IN
Source
Indian Science Cruiser, Vol 33, No 6 (2019), Pagination: 35-40Abstract
The purpose of this study is to analyse the quality parameters of paperboard products mainly Hinge Lid Package (HLP) printed by 10 colours Rotogravure which are stacked in Good Pallet and Autosplice Pallet. The observation methodology and the collection of data is based on interpretative approach which contains three parameters: Print to Cut, Cut to Crease & Registration Mark. An experimental approach has been taken, since the aim of the study is to check the variation of print quality in HLPs stacked on Good Pallet which are dispatched to the market for sale and also check the variation of print quality of HLPs printed during auto splicing in order to find out the utilisation of that HLPs for marketing purpose. The study shows that the small variation of quality parameters i.e. Print to Cut, Cut to Crease and Registration Mark beyond the tolerance value affect the print quality of package. A statistical model and graphical analysis was designed to determine the influence of quality parameters on defect minimization. As a main conclusion, checking the quality parameters in regular interval of 30 minutes maintain the print quality to a greater extend.Keywords
Rotogravure, Print to Cut, Cut to Crease, Registration Mark.References
- C. H. Hagemeyer, and J. K. Gershenson, (2006), “Classification and application of problem solving quality tools,” The TQM Magazine Vol.8, No.5, pp. 455-483.
- M. Spring, R. McQuater, K. Swift, B. Dale and J. Booker (1998), “The use of quality tools and techniques in product introduction: an assessment methodology,” The TQM Magazine Vol.10, No.1, pp. 45-50.