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Cooling of Electronic Equipment Utilizing Nanofluids in Minichannel Mounted over a Heat Pipe
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Modern day microprocessor has increased remarkably in computational capacity which in turn has resulted in generation of higher heat fluxes. Air based conventional heat extraction systems are bungling to eradicate the aforesaid heat fluxes as the need of information technology and high computational facility is skyrocketing. In this present study, numerical simulation is carried out to analyze and compare the thermal performance of a heat pipe combined with forced convection heat transfer mechanism utilizing nanofluids in a minichannel heat sink for application in CPU cooling. Two phase heat transfer phenomenon employed in heat pipe can accomplish extreme heat removal rate. Temperature gradient along with thermal resistance between the coolant and minichannel heated wall is significantly reduced due to the application of nanofluids. Convective heat transfer coefficient at the condenser end of the heat pipe is noticeably improved with application of nanoparticles into distilled water.
Keywords
Heat pipe, Minichannel, Nanofluid, Electronic Cooling, Two Phase Heat Transfer.
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