International Journal of Vehicle Structures and Systems

Ali Belhocine ¹, Mostefa Bouchetara ¹

Affiliations
1 Department of Mechanical Engineering, Oran University of Science and Technology, DZ

Abstract

This paper presents a thermo-mechanical analysis of dry contact between the brake disc and pads during the braking phase. The simulation strategy is based on computer code ANSYS. The modeling of transient temperature in the disc is used to identify the influence of geometric design of the disc to install the ventilation system in vehicles. A thermo-structural analysis is then used to determine the deformation, Von Mises stresses in the disc and the contact pressure distribution in the pads. The results are satisfactory compared to those found in the literature.

Keywords

Brake Discs, Heat Flux, Heat Transfer Coefficient, Von Mises Stress, Contact Pressure.

Full Text

     

Ali Belhocine ¹, Nouby Mahdi Ghazali ², Oday Ibraheem Abdullah ³

Affiliations
1 Oran University of Science and Technology, DZ
2 Mechanical Engg. Dept., South Valley University, EG
3 System Technology and Mechanical Design Methodology, Hamburg University of Technology, DE

Abstract

The motivation of this work is to identify the thermal effects on the structural and contact behaviour of a disc-pad assembly using a finite element approach. The first analysis is performed on the disc-pad model without the presence of thermal properties. Structural performance of the disc-pad model such as deformation and Von Mises stress is predicted. Next, thermomechanical analysis is performed on the same disc-pad model with the inclusion of convection, adiabatic and heat flux elements. The prediction results of temperature distribution, deformation, stress and contact pressure are presented. Comparison of the structural performance between the mechanical and thermomechanical is also made. Three disc-pad designs are assessed using the developed finite element model.

Keywords

Finite Element Analysis, Braking System, Disc-Pad Interface, Temperature, Deformation, Stress, Contact Pressure.

Full Text