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Chandramma, S.
- Gain and Bandwidth Enhancement of Circular Microstrip Patch Antenna using a Circular Groove Etched Rectangular Metal Sheet Superstrate
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Authors
Affiliations
1 Department of Electronics, Yuvaraja’s College, IN
1 Department of Electronics, Yuvaraja’s College, IN
Source
ICTACT Journal on Microelectronics, Vol 6, No 3 (2020), Pagination: 981-986Abstract
A design of gain and bandwidth enhancement of Circular Microstrip Patch Antenna (CMPA) has been presented employing a circular groove etched in a rectangular metal sheet used as superstrate. The proposed concept is unique, and simple as flexible approach to enhance the gain and bandwidth. A rectangular shaped foam spacer has been used to provide mechanical support to place an optimized groove etched rectangular metal sheet superstrate. The proposed antenna offers about 35.5% of impedance matching bandwidth ranging between 8.45 GHz to 12 GHz with a total bandwidth of 3.55 GHz, whereas a conventional circular patch, resonating at 9.95 GHz, hardly shows about 4.8% of impedance bandwidth (480 MHz) only with co-pol. peak gain of 7dBi. In addition to the enhanced bandwidth characteristics co-pol. peak gain of 10dBi is maintained throughout the operating frequency band. There is 3dBi gain enhancement is achieved when compared to conventional CMPA. For the experimental validation, a set of antenna prototype has been fabricated using the commercially available dielectric substrate. The measured result shows similar with the simulated predictions.Keywords
Bandwidth, Circular Patch Antenna, Circular Groove, Superstrate.
- The Higher Mode Elimination in Microstrip Patch Antenna using Defected Microstrip Surface for Suppression of Cross Polarized Radiations and Improved Isolation
Abstract Views :214 |
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Authors
Affiliations
1 Department of Physics, SBRR Mahajana First Grade College, IN
2 Department of Electronics, Yuvaraja’s College, IN
3 Department of Electronics, Postgraduate Centre, University of Mysore, IN
1 Department of Physics, SBRR Mahajana First Grade College, IN
2 Department of Electronics, Yuvaraja’s College, IN
3 Department of Electronics, Postgraduate Centre, University of Mysore, IN
Source
ICTACT Journal on Microelectronics, Vol 6, No 4 (2021), Pagination: 1005-1009Abstract
This paper proposes unique design technique using defected microstrip surface (DMS) for the suppression of higher mode, reduced cross polarization (XP) and improved isolation. The proposed technique can be easily adapted to any conventional working rectangular microstrip patch antennas (RMPA) in the practical applications. The modification can be made by etching the rectangular slots called DMS of optimized dimensions in the rectangular microstrip patch. This will enhance the radiations by suppressing XP radiations and eliminates nearby undesired higher order mode, which is the source for the XP radiations. In this design the conventional RMPA is designed to resonate at 3.04 GHz with broad side radiations with co-polarized peak gain of 5.2dBi and XP of -15.5dB. The proposed RMPA resonates at the same frequency with a gain of 6dBi. The XP is significantly suppressed by 31dB and it is -46.5dB over the span of ±500, with co-pol to cross-pol isolation of 52.5dB is achieved for S-band applications. The performances of the designed antennas have been experimentally verified.Keywords
Cross–Polarization, DMS, Isolation, RMPA.References
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