Asian Journal of Research in Chemistry

S. A. Gangawane ¹, S. D. Kamat ¹, V. P. Malekar ¹, V. J. Fulari ¹

Affiliations
1 Holography and Materials Research Laboratory, Dept. of Physics, Shivaji University, Kolhapur-416004, IN

Abstract

Here, the Double Exposure Holographic Interferometry (DEHI) technique is used to study the surface deformation on stainless steel substrate, when CdS is deposited on it. In the electrodeposition method at different concentrations, CdSO₄ is used as cadmium source, while Na₂S₂O₃ is used as a sulphur source and ethylene diamine tetra acetic acid (EDTA) is used as a complexing agent. The electro deposition of CdS thin films is carried out by varying the time of deposition. The deposition potential of the compound was studied by cyclic voltammetry. The structural, surface morphological and optical properties of the deposited films have been studied using X-ray diffraction (XRD), scanning electron microscope (SEM) and optical absorption technique respectively. The DEHI technique is used to determine, thickness of thin film and stress to substrate of electrodeposited CdS thin films for various deposition time and at various concentrations.

Keywords

DEHI Technique, Thin Films, Electrodeposition, CdS, XRD, SEM.

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V. P. Malekar ¹, V. J. Fulari ¹

Affiliations
1 Holography and Materials Research Lab., Department of Physics, Shivaji University, Kolhapur-416004, Maharashtra, IN

Abstract

Double Exposure Holographic Interferometry (DEHI) is one of the most important applications of Holographic Interferometry. The reported technique, double exposure holographic interferometry used together with simple mathematical interpretation, which allow immediate finding of stress, mass, fringe width and thickness of thin film. It must be further noted that, fringe spacing changes with time of deposition as well as solution concentration. We have tested the samples for different normalities of solutions. The structural study was carried out by XRD for the conformation of material.

Keywords

DEHI, Exposure, Stress, Fringe Width, Thin Film.

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