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Mahendran, G.
- Optimization of Diffusion Bonding Process Parameters of Aluminium AA6061-Fly Ash Composites Using Taguchi Method
Authors
1 Dept. of Mech. Engg., Sathyabama University, Chennai, Tamil Nadu, IN
2 IFET College of Engg., Villupuram, Tamil Nadu, IN
Source
International Journal of Vehicle Structures and Systems, Vol 9, No 4 (2017), Pagination: 225-227Abstract
This paper focused to determine optimal bonding parameters based on Taguchi method for maximizing bonding strength. The experiments were conducted on diffusion bonding machine using aluminium fly ash (AFA) composites. Three bonding parameters such as temperature, pressure and time, each at three levels were examined. Taguchi L27 orthogonal array was used as a design of experiment. The response table and the analysis of variance (ANOVA) were calculated to determine which process parameters significantly affect the bonding strength and also the % contribution of each parameter. The results show that the combination of factors and their levels of A2B3C3 i.e. the bonding done at a temperature of 475°C with a pressure of 10 MPa and time for 20 minutes yielded the optimum i.e. maximum bonding strength. Finally, ANOVA results indicated that all three process parameters significantly affected the bonding strength with a maximum contribution from the bonding temperature (85.93%), followed by bonding time (12.6%) and bonding pressure (1.48%). It is also observed that the bonding strength of the diffusion bonding process can be improved effectively through this approach.Keywords
Diffusion Bonding, Aluminium Fly Ash, Analysis of Variance, Bonding Strength.References
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- Developing Empirical Relationships to Predict Diffusion Layer Thickness, Hardness and Strength of Al-Cu Dissimilar Joints
Authors
1 Centre for Material Joining & Research, Manufacturing Dept., Annamalai University, IN
2 Mech. Engg, Pondicherry Engineering College, Pondicherry, IN
Source
Indian Welding Journal, Vol 41, No 3 (2008), Pagination: 37-45Abstract
The principal difficulty when joining Aluminium (Al) and commercial grade Copper (Cu) lies in the existence of formation of oxide films and brittle intermetallics in the bond region. However, diffusion bonding can be used to join these alloys without much difficulty. Temperature, pressure and holding time are the three main variables, which govern the integrity of the diffusion bonds. The experiments were conducted based on three factors, five-levels, and central composite rotatable design with full replications technique. Empirical relationships were developed to predict diffusion layer thickness, hardness, strength of Al-Cu joints incorporating process parameters using Response Surface Methodology. The developed relationships can be effectively used to predict the bond properties at 95 % confidence level.