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A Study on Effect of Loading on Kink Angle in Ceramics: Mixed Mode Fracture Mechanics Approach Using Finite Element Analysis
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Although while determining fracture toughness values of materials experimental methods are important, the reasons like the difficulty of forming a commencement slanted middle crack with two crack tips , which has a high hardness like ceramic materials, the difficulty of boozing the and the validity the experiment results have led scientists to improve more active methods.In this study, fracture toughness values of a ceramic Composite material boron carbide particles have been designated in a computer environment using the two dimensional finite elements method. While determining fracture toughness values Linear Elastic Fracture Mechanics (LEFM) approach has been used. The results being taken from analysis using ANSYS 12.0 programme and reliability of finite elements has been understood clearly. The primary goal of the study is to determine and comparing the kink angle for temperature and its equivalent mechanical loading.Predicting Stress intensity factors for mechanical load and thermal loading and crack initiation angle in the case of mixed mode fracture. The analysis carried out different angles of inclinations namely 15 degrees, 30 degrees, 45 degrees, 60 degrees and 75 degrees cracks were considered in this analysis. Predicting stress intensity factors for mechanical equivalent thermal loading and crack initiation angles is dependent on the value of stress in the vicinity of the crack tip. As a result, stress intensity factor is considered as the most significant parameter in this regard because it represents the stress level at the crack tip. SIF's for inclined crack are determined numerically as well as using ANSYS 12.0. After that, the values of stress intensities are incorporated the maximum energy release rate criterion (MERR) to find the kink angle.
Keywords
Stress Intensity Factors, Kink Angle, Thermal Loading, Mechanical Loading, The Maximum Energy Release Rate Criterion (MERR) etc.
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