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Harsha, S.
- Functional Evaluation of Copper in Conventional Wire Bonding as Compared to Gold
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Authors
Affiliations
1 Central Manufacturing Technology Institute, Bengaluru, IN
2 Karunya Institute of Technology and Sciences, Coimbatore, IN
1 Central Manufacturing Technology Institute, Bengaluru, IN
2 Karunya Institute of Technology and Sciences, Coimbatore, IN
Source
Manufacturing Technology Today, Vol 18, No SP 3 (2019), Pagination: 62-67Abstract
In the wire bonding process, the ever increasing gold (Au) price has created a necessity for looking at alternate materials viz., copper (Cu) for wire bonding, allowing Cu wire bonding to make a dramatic progress in recent years. The trend to shift towards Cu wire is expected to advance further in future, thus further improvement of bonding technique is indispensable as there are many challenges viz., handling of fragile pad structure, peeling, cracking below the bond pad, high oxidation rate, hardness and lower bondability of the wire bonds. In this paper, a series of experiments and characterizations (Mechanical, Electrical & SEM (Scanning Electron Microscope) has been conducted with 1mil Au and Cu wires to experimentally prove that Cu is a reliable replacement for Au in wire bonding process.Keywords
Gold, Copper Ball and Wedge Bonds, Bond Parameters and Characterization.References
- Chauhan, P; Choubey, A; Zhong, Z; and Pecht, M: Copper Wire Bonding, 2014.
- Tobergte, DR and Curtis, S: Wire Bonding in Microelectronics, vol. 53, no. 9, 2013.
- Zhong, ZW:Wire bonding using copper wire, Micro electron. Int., vol. 26, no. 1, pp. 10–16, 2009.
- England, L; Eng, ST; Liew, C; and Lim, HH: Cu wire bond parameter optimization on various bond pad metallization and barrier layer material schemes, Micro Electron. Reliab, vol. 51, no. 1, Jan. 2011, pp. 81–87.
- S. Kaimori, T. Nonaka, and A. Mizoguchi, “The development of Cu bonding wire with oxidation-resistant metal coating,” IEEE Trans. Adv. Packag., vol. 29, no. 2, pp. 227–231, 2006.
- M. N. M. Ching and K. J. Lee, “Influence of nitrogen and forming gas towards palladium coated copper wire,” 2011 IEEE 13th Electron. Packag. Technol. Conf. EPTC 2011, pp. 318–323, 2011.
- S. Srikamonsirisak, U. Tantinuchawong, and Y. Satirakul, “Parameters Optimization of Copper Wire Bonding on Thin Small Outline Package,” vol. 23, no. 1, pp. 13–17, 2013.
- MIL-STD-883G, “Department of Defense Test Method Standard Microcircuits”.
- George Harman “Wire Bonding in Microelectronics” Third Edition.
- Heraeus “Bonding wires for Semiconductor Technology”.
- Jaesik Lee, “Process Quality Improvement in Thermosonic Wire Bonding”.
- Flynn Carson, STATS ChipPAC Inc., 47400 Kato Rd, Fremont, CA 94538, “Die to Die Copper Wire Bonding Enabling Low Cost 3D Packaging”
- Chapter A: Wire bonding, “Bond evaluation methods”
- Journal of Metals, Materials and Minerals, Vol.23 No.1 pp.13-17, 2013, “Parameters Optimization of Copper Wire Bonding on Thin Small Outline Package”
- C. D. Breach, Gold Bulletin, vol. 43 no. 3 2010, “What is the future of bonding wire? Will copper entirely replace gold?”
- Article-24 March 2014 Microelectronics Reliability, “Insulated Cu wire free air ball characterization”.
- Randy Schueller, Ph.D. DfR Solutions Minneapolis, MN, “COPPER WIRE BOND FAILURE MECHANISMS”.
- U.S std book, NBS Technical note 726, “Testing and Fabrication of Wire Bond Electrical connections- A comprehensive survey”
- Parametric Optimization and Analysis of Pressure Sensor Chip Membrane using Design of Experiments (DOE)
Abstract Views :229 |
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Authors
Affiliations
1 Indian Institute of Technology (IIT), Tirupati, IN
2 Central Manufacturing Technology Institute, Bengaluru, IN
1 Indian Institute of Technology (IIT), Tirupati, IN
2 Central Manufacturing Technology Institute, Bengaluru, IN
Source
Manufacturing Technology Today, Vol 19, No 9 (2020), Pagination: 13-16Abstract
MEMS offers the uses of the membrane in various applications such as pressure sensors and micro-pumps. The working principle of all these devices is based on the deflection of the membrane due to the application of force. Piezoresistive pressure sensors are simpler to integrate with electronics, and they are inherently more linear than capacitive pressure sensors. The parameter optimization of the membrane is the prime challenge for achieving the best performance of the device. In this paper, the parametric optimization is incorporated for aspect ratio in terms of excellent sensitivity and linearity with the help of the design of experiments (DOE) and ANSYS. It is observed that the aspect ratio of 0.04 gives the maximum deformation with the elastic behaviour, among other sample points of the design.Keywords
MEMS, Piezoresistive, Sensitivity, Membrane, DOE.- Development of Signal Conditioning System for Biosensor Applications
Abstract Views :188 |
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Authors
Affiliations
1 Central Manufacturing Technology Institute, Bangalore, IN
1 Central Manufacturing Technology Institute, Bangalore, IN
Source
Manufacturing Technology Today, Vol 19, No 9 (2020), Pagination: 56-59Abstract
This signal conditioning circuit design is a micro-power, three terminal electrochemical cell amplifier that uses less than 1-μA total supply current for battery-powered or energy-harvested sensor applications. Electrochemical cells necessitate constant bias, which requires the amplifier circuit to be powered continuously to eliminate sensor start-up and settling times. The design is assembled on a dotted board compatible with the development Kit platform to allow testing with an MSP430 ultra-low-power processor to utilize the launchpad processor analog to digital converters (ADCs) and liquid crystal display (LCD) for stand-alone operation. The whole design consideration is done after taking into consideration of three-terminal screen printed electrode that can have several applications as verified by experimentations and results. The design can be used for agricultural applications as a wide range of sensor current has been taken into design consideration. This needs simple modification based on sensitivity and response time of sensor.Keywords
MSP430, Op-Amp, Screen Printed Electrode, Trans-Impedance Amplifier, Potentiostat, Current Source.- Design and fabrication of platinum Thin-Film based Temperature Sensor
Abstract Views :253 |
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Authors
Affiliations
1 Central Manufacturing Technology Institute, Bengaluru, IN
1 Central Manufacturing Technology Institute, Bengaluru, IN