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Sharma, I. C.
- Optimization of LTCC Structure for Stable Interconnections
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1 CSIR – Central Electronics Engineering Research Institute, Pilani, Rajasthan, IN
1 CSIR – Central Electronics Engineering Research Institute, Pilani, Rajasthan, IN
Source
Manufacturing Technology Today, Vol 13, No 10 (2014), Pagination: 18-19Abstract
Reliability of electrical connections of a Low Temperature Co-fired Ceramics (LTCC) device is always a challenge. LTCC base plates are fabricated, over which a device or a sensor can be placed. Vias punched at the corners allows the provision for the electrical connection to the sensor. Conductive PdAg lines printed over the surface can be used to join the sensor part with the base plate using brazing technique. Cost of fabrication is lowered by punching the cavities using a zig fixture.Keywords
Low Temperature Co-Fired Ceramics (LTCC), Base Plate, TCE, Sensor.- Fabrication of Inductor in LTCC Technology
Abstract Views :151 |
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Authors
Affiliations
1 CSIR-Central Electronics Engineering Research Institute, Pilani, Rajasthan, IN
1 CSIR-Central Electronics Engineering Research Institute, Pilani, Rajasthan, IN